It simulates physical interactions in applications ranging from consumer product design to aerospace design. OpenFOAM is an open-source HPC workload for computation fluid dynamics (CFD), used in a wide variety of industries to reduce development time and costs. OpenFOAM 5 with Micron DDR5 runs two times faster Faster execution time means weather forecasters can either choose bigger datasets or run more models.We were able to execute 1.3567 time steps per second using Micron DDR5 and 4 th Gen AMD EPYC Processors as compared to 2.8533 time steps per second.For this effort, the Continental United States (CONUS) at 2.5-km lateral resolution was chosen. WRF typically performs well on traditional HPC architectures that support high floating-point processing, high memory bandwidth and a low-latency network. This HPC workload code is used by the weather and climate community, and the model is widely used for meteorological applications. Weather research and forecasting (WRF) 4 runs two times faster with Micron DDR5 This result means that customers can run larger artificial intelligence/machine learning (AI/ML) projects or do more HPC computations with increased memory bandwidth from DDR5.Double the memory bandwidth of 378 GB/s for a single-socket DDR5 system.DDR5 system 4 th Gen AMD EPYC Processors with 96 cores and 3.7 GHz DDR5 4800 MHz system 3 is fully populated with 64GB RDIMM.DDR4 system 3 rd Gen AMD EPYC Processors with 64 cores and 3.7 GHz DDR4 3200 MHz system 2 is fully populated with 64GB RDIMM.It captures peak memory bandwidth for HPC systems STREAM 1 is a simple, well-known benchmark that measures memory bandwidth in HPC computers. All of our test results have shown two times the performance improvement.ĭouble the memory bandwidth with Micron DDR5 + 4 th Gen AMD EPYC Processors using STREAM DDR5 memory helps organizations reach those insights faster, whether on premises or in the cloud. Consider some of the following proof points generated while testing Micron DDR5 with the latest AMD Zen 4 96-core CPU with an industry-standard HPC workload benchmark. Now, server CPUs and memory can be in much better balance to unlock performance and efficiency for the most demanding workloads. Micron DDR5 memory and the new AMD Zen 4 server architectures featuring 4 th Gen AMD EPYC Processors change that. There is just not enough memory bandwidth to supply the growing number of high-performance cores. While server CPUs have grown in performance and throughput, the past several years have seen the bandwidth provided by DDR4 memory become a bottleneck. These clusters require the latest and greatest compute, fabric, memory and storage infrastructure to address the scalability, low latency and performance needs of such critical workloads. With advances in computer architectures, these workloads have increasingly been hosted in very large “scale-out” clusters of high-performance servers. These complex workloads are dedicated to solving some of humankind’s most challenging problems - weather and climate simulations seismic modeling chemical, physics and biological analysis and more. These are often large-scale, data-intensive workloads split into millions of operations that are run in parallel and use terabytes of data. High-performance computing (HPC) workloads have historically been the domain of some of the world’s fastest supercomputers. In this blog, we look at some common HPC-workload benchmark results that use Micron DDR5 data center memory with 4 th Gen AMD EPYC TM Processors as both these products are shipping now. To that end, the two companies have a joint server lab in Austin, working to ensure we are reducing time to validate server memory and performing joint workload testing throughout validation and launch. The goal of the AMD and Micron collaboration is to deliver best-in-class user experiences across client and data center platforms.
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